agilent aba-51563 3.5 ghz broadband silicon rfic amplifier data sheet description agilents aba-51563 is an economical, easy-to-use, inter- nally 50-ohm matched silicon monolithic broadband amplifier that offers excellent gain and flat broadband response from dc to 3.5 ghz. packaged in an ultra- miniature industry-standard sot-363 package, it requires half the board space of a sot-143 package. at 2 ghz, the aba-51563 offers a small-signal gain of 21.5 db, output p1db of 1.8 dbm and 11.4 dbm output third order intercept point. it is suitable for use as buffer amplifiers for wideband applications. they are designed for low cost gain blocks in cellular applications, dbs tuners, lnb and other wireless communications systems. aba-51563 is fabricated using agilents hp25 silicon bipolar process, which employs a double- diffused single polysilicon process with self-aligned submi- cron emitter geometry. the process is capable of simulta- neous high f t and high npn breakdown (25 ghz f t at 6v bvceo). the process utilizes industry standard device oxide isolation technologies and submicron aluminum multilayer interconnect to achieve superior performance, high uniformity, and proven reliability. features operating frequency: dc ~ 3.5 ghz 21.5 db gain vswr < 2.0 throughout operating frequency 1.8 dbm output p1db 3.7 db noise figure unconditionally stable single 5v supply (id = 18 ma) lead-free option available applications amplifier for cellular, cordless, special mobile radio, pcs, ism, wireless lan, dbs, tvro, and tv tuner applications surface mount package sot-363/sc70 pin connections and package marking simplified schematic note: top view. package marking provides orientation and identification. x is character to identify date code. vcc gnd 3 ahx input gnd 2 gnd 1 outpu t & vcc vcc ground 2 ground 1 ground 3 rf input rf output & vcc attention: observe precautions for handling electrostatic sensitive devices. esd machine model (class a) esd human body model (class 1a) refer to agilent application note a004r: electrostatic discharge damage and control.
2 aba-51563 absolute maximum ratings [1] symbol parameter units absolute max. v cc device voltage, rf output to ground (t = 25 c) v +7 p in cw rf input power (vcc = 5v) dbm +20 p diss total power dissipation [3] w 0.3 t j junction temperature c 150 t stg storage temperature c -65 to 150 notes: 1. operation of this device in excess of any of these limits may cause permanent damage. 2. thermal resistance measured using 150 c liquid crystal measurement technique. 3. board (package belly) temperature, tb, is 25 c. derate 2.3 mw/ c for tb > 120.8 c. electrical specifications t c = +25 c, z o = 50 ? , p in = -30 dbm, v cc = 5v, freq = 2 ghz, unless stated otherwise. symbol parameter and test condition units min. typ. max. std dev. gp [1] power gain (|s 21 | 2 ) db 20 21.5 0.2 ? gp power gain flatness, f = 0.1 ~ 2.5 ghz db 1.0 f = 0.1 ~ 3.5 ghz 1.3 nf [1] noise figure db 3.7 4 0.12 p1db [1] output power at 1db gain compression dbm 1.8 0.13 oip3 [1] output third order intercept point dbm 11.4 0.24 vswr in [1] input vswr 1.2 vswr out [1] output vswr 1.2 icc [1] device current ma 18 28 0.3 td [1] group delay ps 140 notes: 1. measurements taken on 50 ? test board shown on figure 1. excess circuit losses had been de-embedded from actual measurements. standard deviation and typical data based on at least 500 parts sample size from 6 wafer lots. future wafers allocated to this product m ay have nominal values anywhere within the upper and lower spec limits. figure 1. aba-51563 production test circuit. rf outpu t rf input vcc rfc c block c block c bypass ahx thermal resistance [2] (vcc = 5v) jc = 104 c/w
3 aba-51563 typical performance t c = +25 c, z o = 50 ? , v cc = 5v unless stated otherwise. frequency (ghz) figure 7. output power for 1 db gain compression vs. frequency and temperature. p1db (dbm) 0 6 4 2 0 -2 -4 -6 4 1 0.5 2 2.5 3 1.5 3.5 -40 c +25 c +85 c frequency (ghz) figure 6. output power for 1 db gain compression vs. frequency and voltage. p1db (dbm) 0 6 4 2 0 -2 -4 -6 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) figure 5. noise figure vs. frequency and temperature. nf (db) 0 6 5 4 3 2 4 1 0.5 2 2.5 3 1.5 3.5 -40 c +25 c +85 c frequency (ghz) figure 4. noise figure vs. frequency and voltage. nf (db) 0 4.5 4 3.5 3 2.5 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v frequency (ghz) figure 3. gain vs. frequency and temperature. gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 -40 c +25 c +85 c frequency (ghz) figure 2. gain vs. frequency and voltage. gain (db) 0 23 22 21 20 19 18 17 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v
4 frequency (ghz) figure 10. input and output vswr vs. frequency. vswr 0 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 6 1 34 2 5 vswr in vwsr out voltage (v) figure 11. supply current vs. voltage and temperature. icc (ma) 0 60 50 40 30 20 10 0 2 1 456 3 7 +25 c -40 c +85 c aba-51563 typical performance, continued t c = +25 c, z o = 50 ? , v cc = 5v unless stated otherwise. frequency (ghz) figure 9. output ip3 vs. frequency and temperature. oip3 (dbm) 0 16 12 8 4 0 4 1 0.5 2 2.5 3 1.5 3.5 -40 c +25 c +85 c frequency (ghz) figure 8. output ip3 vs. frequency and voltage. oip3 (dbm) 0 20 16 12 8 4 0 4 1 0.5 2 2.5 3 1.5 3.5 4.5v 5v 5.5v
5 aba-51563 typical scattering parameters t c = +25 c, v cc = 5v, z o = 50 ? , unless stated otherwise freq s 11 s 11 s 21 s 21 s 21 s 12 s 12 s 12 s 22 s 22 k (ghz) mag. ang. db mag. ang. db mag. ang. mag. ang. factor 0.05 0.06 175.8 20.8 10.93 -2.3 -27.3 0.04 -0.8 0.08 -2.3 1.294 0.10 0.06 174.1 20.7 10.88 -4.4 -27.3 0.04 -1.4 0.08 -6.0 1.297 0.20 0.06 170.4 20.8 10.93 -8.6 -27.5 0.04 -2.5 0.07 -11.5 1.313 0.30 0.06 166.0 20.8 10.93 -12.8 -27.5 0.04 -3.3 0.07 -15.1 1.313 0.40 0.06 160.6 20.8 10.97 -17.1 -27.7 0.04 -3.8 0.07 -17.7 1.331 0.50 0.07 161.9 20.8 10.97 -21.4 -27.7 0.04 -4.1 0.07 -17.7 1.330 0.60 0.07 160.0 20.8 10.99 -25.6 -28.0 0.04 -4.6 0.07 -17.8 1.351 0.70 0.07 155.8 20.9 11.04 -30.0 -28.0 0.04 -4.8 0.07 -18.9 1.346 0.80 0.08 153.5 20.9 11.10 -34.2 -28.2 0.04 -5.0 0.07 -18.5 1.365 0.90 0.08 150.4 20.9 11.13 -38.6 -28.2 0.04 -4.9 0.07 -14.7 1.361 1.00 0.08 148.0 21.0 11.20 -43.0 -28.4 0.04 -4.9 0.08 -9.9 1.380 1.20 0.08 132.5 21.1 11.35 -52.0 -28.6 0.04 -4.4 0.08 11.6 1.391 1.40 0.09 118.9 21.2 11.51 -61.1 -28.9 0.04 -3.8 0.08 26.1 1.403 1.60 0.09 102.9 21.4 11.69 -70.7 -28.9 0.04 -2.7 0.08 37.7 1.386 1.80 0.10 86.5 21.5 11.85 -80.6 -29.1 0.04 -1.3 0.09 44.3 1.399 2.00 0.10 69.6 21.5 11.94 -90.7 -29.1 0.04 0.3 0.10 47.9 1.391 2.20 0.11 50.6 21.6 12.04 -101.2 -29.1 0.04 1.9 0.11 45.1 1.382 2.40 0.10 38.4 21.7 12.15 -112.1 -29.1 0.04 3.0 0.13 41.1 1.369 2.60 0.10 30.1 21.7 12.14 -123.5 -28.9 0.04 4.3 0.16 36.7 1.339 2.80 0.10 17.8 21.6 12.00 -135.3 -28.9 0.04 5.7 0.19 31.6 1.341 3.00 0.09 10.2 21.4 11.70 -147.3 -28.9 0.04 7.4 0.21 26.7 1.354 3.20 0.10 -1.1 21.0 11.27 -158.9 -28.6 0.04 9.8 0.24 21.4 1.352 3.40 0.09 -15.7 20.6 10.73 -170.5 -28.2 0.04 10.8 0.25 14.4 1.343 3.50 0.08 -20.5 20.4 10.45 -176.2 -28.0 0.04 11.4 0.26 11.2 1.337 4.00 0.05 -52.8 18.9 8.86 157.4 -27.1 0.04 12.4 0.27 -4.6 1.389 4.50 0.00 -179.7 17.4 7.40 133.1 -26.2 0.05 12.3 0.27 -18.4 1.457 5.00 0.04 127.8 15.6 6.06 112.1 -25.2 0.06 11.0 0.24 -32.2 1.568 5.50 0.10 114.7 14.1 5.09 92.7 -24.0 0.06 7.2 0.24 -47.4 1.597 6.00 0.16 105.3 12.7 4.30 75.7 -23.0 0.07 1.9 0.20 -62.0 1.657
6 device models refer to agilents web site www.agilent.com/view/rf package dimensions outline 63 (sot-363/sc-70) recommended pcb pad layout for agilent's sc70 6l/sot-363 products e he d e a1 b a a2 q1 l c dimensions (mm) min. 1.15 1.80 1.80 0.80 0.80 0.00 0.10 0.15 0.10 0.10 max. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.30 0.20 0.30 symbol e d he a a2 a1 q1 e b c l notes: 1. all dimensions are in mm. 2. dimensions are inclusive of plating. 3. dimensions are exclusive of mold flash & metal burr. 4. all specifications comply to eiaj sc70. 5. die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. package surface to be mirror finish. 0.650 bcs 0.026 0.079 0.018 0.039 dimensions in inches. ordering information part number devices per container container aba-51563-tr1 3000 7" reel aba-51563-tr2 10000 13" reel aba-51563-blk 100 antistatic bag aba-51563-tr1g 3000 7" reel aba-51563-tr2g 10000 13" reel aba-51563-blkg 100 antistatic bag note: for lead-free option,the part number will have the character g at the end.
7 device orientation tape dimensions and product orientation for outline 63 user feed direction cover tape carrier tape reel end vie w 8 mm 4 mm top view (package marking example orientation shown.) ah ah ah ah p p 0 p 2 f w c d 1 d e a 0 10 max. t 1 (carrier tape thickness) t t (cover tape thickness) 10 max. b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.50 0.10 4.00 0.10 1.75 0.10 0.061 + 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 + 0.30 - 0.10 0.254 0.02 0.315 + 0.012 0.0100 0.0008 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance width tape thickness c t t 5.40 0.10 0.062 0.001 0.205 + 0.004 0.0025 0.0004 cover tape
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (65) 6756 2394 india, australia, new zealand: (65) 6755 1939 japan: (+81 3) 3335-8152(domestic/international), or 0120-61-1280(domestic only) korea: (65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (65) 6755 2044 taiwan: (65) 6755 1843 data subject to change. copyright ? 2004 agilent technologies, inc. obsoletes 5988-9178en december 4, 2004 5989-1970en
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